Compute build-out meets local power, water and packaging limits
A conditional statement under stated assumptions, never a prediction.
Contents
- ·Edition home
- ·Executive summary
- 1AI compute is physical infrastructure built on a few chips and a few places
- 2Key findings
- 3Systems and sectors at baseline
- 4Risks and capability
- 5Compute build-out meets local power, water and packaging limits
- 6Readings from the other desks
- 7The 2027 agenda
- 8Systems in depth
- AMethodology
- BData appendix
- CReferences and record
- ·Complete edition, for print
5.1Assumptions
Scenario SCN-XT06-PWR-01: what is assumed, and what is held constant.
- Baseline
- the 2026 reference state in this edition
- Drivers
- AI compute demand keeps growing while grid connection, water supply and packaging capacity grow more slowly
- Analogues
- the 2023 to 2028 range of US data centre load; the 2019 to 2025 growth of AI supercomputers115
- Interventions
- none modelled: the specification describes the unmitigated case
- Run state
- narrative specification; quantified run scheduled for 2027
5.2The cascade, step by step
- 1
AIC → ENE
new compute sites queue for grid connection
2025
- 2
ENE → WAT
cooling and plant water demand meets local supply limits
2026
- 3
INF → AIC
packaging and memory capacity limits the chips that can be used
2025
- 4
TRD → INF
export-control changes shift where equipment and chips can go
2026
- 5
GOV → FIN
subsidy programmes move capacity to new regions over several years
2026
- 6
FIN → INF
investment shifts toward efficiency, power supply and packaging
2025
5.3The scenario as a table of steps
How the shock in scenario SCN-XT06-PWR-01 would travel through Advanced Semiconductors and AI Compute’s coupled systems, step by step, under the assumptions the edition states.
| Step | What happens | Source |
|---|---|---|
| 01 AI compute to energy | New compute sites queue for grid connection. Analogue or source: 2025. | Edition XT-06, scenario SCN-XT06-PWR-01, step 1 |
| 02 Energy to water | Cooling and plant water demand meets local supply limits. Analogue or source: 2026. | Edition XT-06, scenario SCN-XT06-PWR-01, step 2 |
| 03 Infrastructure to ai compute | Packaging and memory capacity limits the chips that can be used. Analogue or source: 2025. | Edition XT-06, scenario SCN-XT06-PWR-01, step 3 |
| 04 Trade to infrastructure | Export-control changes shift where equipment and chips can go. Analogue or source: 2026. | Edition XT-06, scenario SCN-XT06-PWR-01, step 4 |
| 05 Governance to finance | Subsidy programmes move capacity to new regions over several years. Analogue or source: 2026. | Edition XT-06, scenario SCN-XT06-PWR-01, step 5 |
| 06 Finance to infrastructure | Investment shifts toward efficiency, power supply and packaging. Analogue or source: 2025. | Edition XT-06, scenario SCN-XT06-PWR-01, step 6 |
A teaching model of a conditional scenario under the edition’s stated assumptions: not a forecast, not a prediction and not a warning. Sources: Advanced Semiconductors and AI Compute 2026, scenario SCN-XT06-PWR-01 (2026); Advanced Semiconductors and AI Compute 2026, references (NR-CIT-1) (2026).
Notes
Numbers are the edition’s reference numbers, so a note reads the same in every chapter. The full list, with every source and its licence, is in Annex C. Annex C, references
- 1Pilz, K.F., Sanders, J., Rahman, R. and Heim, L., Trends in AI Supercomputers, arXiv:2504.16026, submitted 22 April 2025 (abstract page: 500 systems from 2019 to 2025; performance doubling about every nine months; cost and power doubling about every year; one March 2025 system with about 200,000 chips, USD 7 billion and 300 MW; about 75% of performance in the United States). arXiv, Ithaca. Observation year 2025. Accessed 2026-11-03.back
- 15US Department of Energy (ed.), DOE Releases New Report Evaluating Increase in Electricity Demand from Data Centers, 20 December 2024 (176 TWh in 2023, about 4.4%; 325 to 580 TWh, about 6.7% to 12%, in 2028). US Department of Energy, Washington. Observation year 2023. Accessed 2026-11-03.back
