The 2027 agenda
Eight bounded questions open the 2027 semiconductor and compute agenda. Each comes from a baseline finding, names the initiative that will carry it and the first output due in the 2027 semiconductor and compute edition.
Contents
- ·Edition home
- ·Executive summary
- 1AI compute is physical infrastructure built on a few chips and a few places
- 2Key findings
- 3Systems and sectors at baseline
- 4Risks and capability
- 5Compute build-out meets local power, water and packaging limits
- 6Readings from the other desks
- 7The 2027 agenda
- 8Systems in depth
- AMethodology
- BData appendix
- CReferences and record
- ·Complete edition, for print
7.1Questions for the operational series
- Q-01
How much power and cooling water do advanced fabrication plants and AI data centres need, on a common basis, and where do the limits fall?
INI-XT06-PWR-01 · power and water footprint; first output: footprint estimates by site type.
- Q-02
What advanced packaging and high-bandwidth memory capacity exists, and in which places?
INI-XT06-PKG-02 · packaging and memory; first output: capacity map.
- Q-03
Which equipment and materials are single points of failure for advanced chips?
INI-XT06-EQP-03 · equipment and materials; first output: dependence map.
- Q-04
How far have announced subsidies become delivered plants and output?
INI-XT06-SUB-04 · subsidy delivery; first output: award and outlay table.
- Q-05
How can chip, system and compute counts be compared on a common basis?
INI-XT06-BMK-05 · counts on a common basis; first output: benchmark table.
- Q-06
Which national export-control and licensing rules apply to advanced computing items, and how do they differ?
To be admitted in 2027; first output: rule overlay.
- Q-07
What workforce exists for fabrication, packaging and data centre operation?
To be admitted in 2027; first output: scoping note.
- Q-08
Which readiness capabilities have been tested in real shortages or disruptions, and which are only planned?
Readiness capability register; first output: rung evidence for 15 functions.
7.2Portfolio proposed for the Q1 2027 alignment
Five initiatives and one Universe mission candidate are proposed for the 2027 semiconductor and compute portfolio. They are programme objects: no partner, funder or member is attached to them in this edition.
| ID | Object | Kind | Question | State |
|---|---|---|---|---|
| INI-XT06-PWR-01 | Power and water footprint | Initiative | Q-01 | PROPOSED |
| INI-XT06-PKG-02 | Packaging and memory | Initiative | Q-02 | PROPOSED |
| INI-XT06-EQP-03 | Equipment and materials | Initiative | Q-03 | PROPOSED |
| INI-XT06-SUB-04 | Subsidy delivery | Initiative | Q-04 | PROPOSED |
| INI-XT06-BMK-05 | Counts on a common basis | Initiative | Q-05 | PROPOSED |
| MSN-XT06-2027-01 | Local limits Universe mission | Mission | Q-01 | Candidate |
7.3The pathway
The semiconductor edition reads national readiness chapters, the coupled sector reports on energy, minerals and cybersecurity, and the global edition through one governed evidence graph. At baseline the federation is designed; the global energy and lifeline editions are drafted. This page states what exists today and what comes next.
- 01
National readiness chapters
fabrication, power and trade readiness in each national edition
IN PREPARATION · national baselines
- 02
Sector couplings
GS-02 energy · SR-04 minerals · SR-03 supply chains
GS-02 DRAFTED · sector baselines
- 03
Technology system model
fabrication, equipment, memory, power, water, governance
v0 SPECIFIED · v1 with federation evidence
- 04
Strategic links
SR-13 strategic technology · XT-07 HPC
PLANNED · strategic baselines
- 05
Universe
annual proving environment
CANDIDATE MISSION · mandate in 2027
- 06
XT-06 report
this series
BASELINE DRAFT · 2027 annual edition
- 07
Evidence and correction
one graph, many projections
OPEN · first correction cycle in 2027
7.4Universe 2027: evidence pack for the semiconductor and compute candidate mission
- 01
Mandate
- 02
Core Build · 1 month
- 03
Action · 1 week
- 04
Evidence seal
- 05
Portfolio correction
- 06
Next mandate
| Item | Record | State | Timing |
|---|---|---|---|
| F1 | Annual mandate record | PLANNED | after the Q2 2027 alignment |
| F2 | Core Build record | PLANNED | one month before the exercise |
| F3 | Exercise evidence | PLANNED | during the Action week |
| F4 | Decision packets | PLANNED | exercise state only |
| F5 | Proof receipts | PLANNED | scoped to each recorded check |
| F6 | After-action report | PLANNED | within one quarter |
| F7 | Upgrade docket | PLANNED | routed to the Portfolio |
| F8 | Portfolio renewal | PLANNED | 2027 global annual edition |
| F9 | Public synthesis | PLANNED | public-safe extracts only |
Mission
- ID
- MSN-XT06-2027-01 · Local limits Universe mission
- Role spine
- Leadership sponsor · Institutional anchor · Mission lead: drawn from national pathways
- Receiving actors
- to be identified with the mandate
7.5Handoffs and routing
Where the baseline’s findings go next. A handoff routes a finding for awareness, review or work; it transfers no authority.
| Finding | Routed to | Purpose | Class |
|---|---|---|---|
| AIC-001 · AI supercomputer growth | INI-XT06-BMK-05 | counts on a common basis | PUBLIC |
| FIN-004 · chip sales | INI-XT06-SUB-04 | subsidy delivery | PUBLIC |
| FIN-005 · equipment billings | INI-XT06-EQP-03 | equipment and materials | PUBLIC |
| INF-006 · foundry concentration | INI-XT06-PKG-02 | packaging and memory | PUBLIC |
| ENE-007 · US data centre energy | INI-XT06-PWR-01 · key F review | power and water footprint | PUBLIC |
| GOV-010 · EU Chips Act | regional consortia | rule overlay | PUBLIC |
| TRD-011 · export controls | regional consortia | rule overlay | PUBLIC |
| SYS-012 · compound pathway | MSN-XT06-2027-01 | Universe candidate | CONSORTIUM |
| Class | Where it goes | Who can see it |
|---|---|---|
| PUBLIC | the published edition and its evidence bundle | anyone |
| CONSORTIUM | governed rooms of the federation | consortium members under agreement |
| CONTROLLED | need-to-know channels | named competent actors only |
7.6Feeds and signal register
| Feed | Producer | Latency | Feeds into |
|---|---|---|---|
| SIA monthly and annual sales releases | industry association | monthly | FIN-004 |
| Equipment billings releases | SEMI | quarterly | FIN-005 |
| NIST CHIPS award pages (post-close, context only) | NIST | per event | GOV-009 |
| European Commission Chips Act pages | European Commission | per release | GOV-010 |
| US export-control notices | US Department of Commerce | per event | TRD-011 |
| WSTS forecasts | WSTS | twice a year | FIN-004 |
| Epoch AI data and reports | research organisation | continuous | AIC-002 |
Escalation routes
- none · keep monitoring
- research question
- project
- risk object
- annual publication
- signal report
| ID | Signal | Corroboration | Systems | Route |
|---|---|---|---|---|
| SIG-XT06-001 | AI supercomputer performance doubling about every nine months1 | CORROBORATED | AIC · INF | research question Q-05 |
| SIG-XT06-002 | US data centre electricity projected at 325 to 580 TWh by 202815 | CORROBORATED | ENE · AIC | research question Q-01 |
| SIG-XT06-003 | EU second Chips Act proposed in June 202612 | PARTIAL | GOV · INF | initiative Q-04 |
Notes
Numbers are the edition’s reference numbers, so a note reads the same in every chapter. The full list, with every source and its licence, is in Annex C. Annex C, references
- 1Pilz, K.F., Sanders, J., Rahman, R. and Heim, L., Trends in AI Supercomputers, arXiv:2504.16026, submitted 22 April 2025 (abstract page: 500 systems from 2019 to 2025; performance doubling about every nine months; cost and power doubling about every year; one March 2025 system with about 200,000 chips, USD 7 billion and 300 MW; about 75% of performance in the United States). arXiv, Ithaca. Observation year 2025. Accessed 2026-11-03.back
- 15US Department of Energy (ed.), DOE Releases New Report Evaluating Increase in Electricity Demand from Data Centers, 20 December 2024 (176 TWh in 2023, about 4.4%; 325 to 580 TWh, about 6.7% to 12%, in 2028). US Department of Energy, Washington. Observation year 2023. Accessed 2026-11-03.back
- 12European Commission (ed.), European Chips Act policy page (entered into force 21 September 2023; three pillars; more than EUR 33 billion across 19 State aid decisions; second Chips Act proposed June 2026). Directorate-General for Communications Networks, Content and Technology, Brussels. Observation year 2026. Accessed 2026-11-03.back
